REDEYE is an infrared-based ultrathin metal film measurement platform which can deliver real-time metal film thickness and composition information down to single-digit angstrom level. RedEye uses spectrally-resolved infrared reflections to measure ultrathin metal films. Due to its broadband nature, RedEye can also be used as a fingerprinting system to screen 100% of the wafers processed for stack consistency.
Similar to electron microscopy and/or atomic force microscopy, the extreme sensitivity of RedEye means the measuring platform must be installed at a properly chosen location where optical noise and mechanical vibration is well-controlled. Among the different deplyment options, RedEye has been confirgured for on-tool applications, including Integrated Metrology (IM) deployment scenarios on leading OEM tools.